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In memoriam Prof. Avram Bar-Cohen

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dc.contributor.authorHodes, M. S.
dc.contributor.authorIyengar, M.
dc.contributor.authorArık, Mehmet
dc.contributor.authorKim, K. J.
dc.contributor.authorSpector, M.
dc.contributor.authorBhavnani, S. H.
dc.contributor.authorJoshi, Y. K.
dc.contributor.authorMahajan, R. V.
dc.contributor.authorRamakrishna, K.
dc.contributor.departmentMechanical Engineering
dc.contributor.ozuauthorARIK, Mehmet
dc.date.accessioned2023-05-03T08:54:10Z
dc.date.available2023-05-03T08:54:10Z
dc.date.issued2021-08
dc.description.abstractThe outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].en_US
dc.identifier.endpage1155en_US
dc.identifier.issn2156-3950en_US
dc.identifier.issue8en_US
dc.identifier.startpage1153en_US
dc.identifier.urihttp://hdl.handle.net/10679/8169
dc.identifier.volume11en_US
dc.identifier.wos000685887800006
dc.language.isoengen_US
dc.peerreviewedyesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEEen_US
dc.relation.ispartofIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.rightsrestrictedAccess
dc.titleIn memoriam Prof. Avram Bar-Cohenen_US
dc.typeBiographical-Itemen_US
dspace.entity.typePublication
relation.isOrgUnitOfPublicationdaa77406-1417-4308-b110-2625bf3b3dd7
relation.isOrgUnitOfPublication.latestForDiscoverydaa77406-1417-4308-b110-2625bf3b3dd7

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