Publication: In memoriam Prof. Avram Bar-Cohen
Institution Authors
Journal Title
Journal ISSN
Volume Title
Type
Biographical-Item
Access
restrictedAccess
Publication Status
Published
Abstract
The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].
Date
2021-08
Publisher
IEEE