Browsing by Author "Kim, K. J."

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    In memoriam Prof. Avram Bar-Cohen
    (IEEE, 2021-08) Hodes, M. S.; Iyengar, M.; Arık, Mehmet; Kim, K. J.; Spector, M.; Bhavnani, S. H.; Joshi, Y. K.; Mahajan, R. V.; Ramakrishna, K.; Mechanical Engineering; ARIK, Mehmet
    The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].
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    In memoriam Prof. Avram Bar-Cohen
    (IEEE, 2021-11) Hodes, M. S.; Kim, K. J.; Arık, Mehmet; Mahajan, R. V.; Ramakrishna, K.; Mechanical Engineering; ARIK, Mehmet
    It has been a little over a year since the passing of Prof. Avram, Avi as he is popularly known, Bar-Cohen. Eulogies from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging still continue to come in. His impact on the electronic packaging community in general and thermal management community, in particular, is profound. The IEEE ITherm Conference renamed Best Paper awards in his honor. The ASME InterPACK Conference renamed its Achievement Award to honor him and is working diligently to elevate it from a Divisional Award to a Society-Level Award. The ASME Journal of Electronic Packaging will be publishing a Special Issue, edited mostly by his former students, in December 2021.