Search
Now showing items 1-10 of 14
A new model for predicting the required pressure difference for pressure swirl atomizers
(Europe, Institute for Liquid Atomization and Spray Systems, ILASS, 2020)
Prior to this study an investigation is made to analyze the accuracies of the semi-empirical correlations of the previous studies by comparing them with a large number of experimental data which is extracted from the works ...
Fluid flow characteristics inside convergent, divergent and straight open-end pressure swirl atomizer
(Europe, Institute for Liquid Atomization and Spray Systems, ILASS, 2020)
Effects of geometrical parameters on the performance of small-scale open-end pressure swirl atomizers (PSA) have been studied using computational fluid dynamics. The shape of the swirl chamber is the main geometrical feature ...
A coupled material removal model for chemical mechanical polishing processes
(IOP Publishing, 2021-10-01)
Chemical mechanical polishing (CMP) is a process used to obtain planarized surfaces in microelectronic device manufacturing. The planarization is achieved by material removal from the wafer surface by synergistic effect ...
Effect of the motion pattern on the turbulence generated by an active grid
(Springer, 2021)
In the field of turbulence research, many experiments are performed using turbulence generated under reproducible conditions. In the past mostly static grids having a fixed blockage were adopted, but in order to generate ...
Benchmark study of 2D and 3D VOF simulations of a simplex nozzle using a hybrid RANS-LES approach
(Elsevier, 2022-07-01)
In this study, a simplex nozzle is tested with water for the benchmarking of different flow simulation models. A large scale Plexi-glass transparent nozzle is used to reduce the influence of production tolerances on the ...
Model-based optimization of CMP process parameters for uniform material removal selectivity in cu/barrier planarization
(IOP Publishing, 2022-02-01)
Chemical mechanical planarization is a process of achieving planar surfaces in the semiconductor manufacturing industry. The planarization of a surface is achieved by material removal from the wafer surface. The material ...
3D simulation of droplet impact on static and moving walls
(Begell House Inc., 2022)
In the present study, the contact angle model and the origin of the parasitic current, precisely, the relation of the parasitic current with grid distribution, have been studied to accurately predict droplet impact on ...
Swelling phenomenon in rubber weatherstrip manufacturing under real process conditions imposed in a commercial extrusion line
(Springer, 2023-01-06)
We investigated the swelling under different process and boundary conditions in a commercial weatherstrip extrusion line. For the experimental investigations, we used two extrusion-dies and three compounds. An in-situ laser ...
Mass flow rate control of solenoid-based injectors
(Sage, 2023-09)
This paper presents a mass flow rate control method for solenoid-based injectors in open-loop, i.e. without physical
sensor feedback. Measuring the mass flow rate in injectors is important because the performance of the ...
Investigation of soot formation of ethylene/air jet diffusion flame with rank correlated slw including ethylene and acetylene radiation
(Begell House Inc., 2023)
Radiation is significant, especially in sooting flames. The interaction between radiation and soot considerably affects the combustion regime. Spectral radiation models that account for the radiative effects of sooting ...
Share this page