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Metal oxide thin film characterization for new generation chemical mechanical planarization development
(The Electrochemical Society, 2016)
This study targets to create a basis for the process development in the new generation semiconductor industry dealing with atomic scale devices. We focus on the CMP process development as it is used for the current and ...
3-D extension of chemical mechanical polishing for nano-structuring applications on alternative technologies
(The Electrochemical Society, 2016)
In this study we tune the chemical mechanical polishing process to a 3-D level to generate controlled nanostructures on functional metallic surfaces such as titanium implants and steel based heating elements. The chemical ...
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