Search
Now showing items 1-2 of 2
Surface characterization driven CMP optimization for gallium nitride
(ECS, 2016)
Gallium nitride is a hard and chemically inert material demoting high material removal rates in the chemical mechanical planarization (CMP) applications. This paper focuses on the optimization of the process conditions to ...
Metal oxide thin film characterization for new generation chemical mechanical planarization development
(The Electrochemical Society, 2016)
This study targets to create a basis for the process development in the new generation semiconductor industry dealing with atomic scale devices. We focus on the CMP process development as it is used for the current and ...
Share this page