Publication: 3-D extension of chemical mechanical polishing for nano-structuring applications on alternative technologies
dc.contributor.author | Özdemir, Zeynep | |
dc.contributor.author | Başım, Gül Bahar | |
dc.contributor.department | Mechanical Engineering | |
dc.contributor.ozuauthor | BAŞIM DOĞAN, Gül Bahar | |
dc.contributor.ozugradstudent | Özdemir, Zeynep | |
dc.date.accessioned | 2017-07-08T12:40:46Z | |
dc.date.available | 2017-07-08T12:40:46Z | |
dc.date.issued | 2016 | |
dc.description.abstract | In this study we tune the chemical mechanical polishing process to a 3-D level to generate controlled nanostructures on functional metallic surfaces such as titanium implants and steel based heating elements. The chemical passivation action of the CMP process on metallic surfaces enables the formation of inert interfaces resistant to corrosion and degradation while the induced nanostructures help tune the surface attachment/detachment ability as these surfaces interact with alternative external elements. | en_US |
dc.identifier.doi | 10.1149/07218.0081ecst | en_US |
dc.identifier.endpage | 84 | en_US |
dc.identifier.issn | 1938-5862 | en_US |
dc.identifier.issue | 18 | en_US |
dc.identifier.scopus | 2-s2.0-85019699347 | |
dc.identifier.startpage | 81 | en_US |
dc.identifier.uri | http://hdl.handle.net/10679/5425 | |
dc.identifier.uri | https://doi.org/10.1149/07218.0081ecst | |
dc.identifier.volume | 72 | en_US |
dc.language.iso | eng | en_US |
dc.peerreviewed | yes | |
dc.publicationstatus | published | en_US |
dc.publisher | The Electrochemical Society | en_US |
dc.relation.ispartof | ECS Transactions | en_US |
dc.relation.publicationcategory | International | |
dc.rights | restrictedAccess | |
dc.subject.keywords | Chemical polishing | en_US |
dc.subject.keywords | Degradation | en_US |
dc.subject.keywords | Metallic compounds | en_US |
dc.subject.keywords | Nanostructures | en_US |
dc.subject.keywords | Polishing | en_US |
dc.subject.keywords | Surface measurement | en_US |
dc.title | 3-D extension of chemical mechanical polishing for nano-structuring applications on alternative technologies | en_US |
dc.type | conferenceObject | en_US |
dspace.entity.type | Publication | |
relation.isOrgUnitOfPublication | daa77406-1417-4308-b110-2625bf3b3dd7 | |
relation.isOrgUnitOfPublication.latestForDiscovery | daa77406-1417-4308-b110-2625bf3b3dd7 |
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