Publication:
Development of 3-D chemical mechanical polishing process for nanostructuring of bioimplant surfaces

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conferenceObject

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restrictedAccess

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published

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Abstract

This study focuses on the development of a three dimensional chemical mechanical polishing (CMP) process to induce smoothness or controlled nano-roughness on the bio-implant material surfaces, particularly for an application on the dental implants. CMP helps produce implant surfaces that are cleaned from potentially contaminated surface layers by removing a nano-scale top layer while simultaneously creating a protective oxide film on the surface to limit any further contamination to minimize risk of infection. Hence, we propose CMP as a synergistic method of nano-structuring on the implant surfaces and focus on extending the process to a 3-D platform to implement it on the dental implants.

Date

2014

Publisher

ECS

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