Show simple item record

dc.contributor.authorAzarifar, M.
dc.contributor.authorArık, Mehmet
dc.contributor.authorXie, B.
dc.contributor.authorLuo, X.
dc.date.accessioned2023-09-20T11:07:49Z
dc.date.available2023-09-20T11:07:49Z
dc.date.issued2023-05
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://hdl.handle.net/10679/8891
dc.identifier.urihttps://ieeexplore.ieee.org/document/10102433
dc.description.abstractA novel concept based on the encapsulation of transparent phase change materials (PCMs) into the optical packaging structure of light-emitting diodes (LEDs) is presented in this article. The concept was initiated by challenges of thermal management of photoluminescent particles in high-power optical systems. LEDs, white LEDs (WLEDs), and porous/network-based photoluminescent matrices can achieve improved thermal networks by embedding PCMs. In this article, paraffin is selected as a suitable PCM encapsulant, and aside from thermal perspectives, an unexpected optical benefit with melted paraffin after surface wetting of the chip was observed. Immersing an LED chip in a melted paraffin pool showed up to an 8% increase in light extraction efficiency and a 1.5% increase in power conversion efficiency (PCE). An accurate dynamic opto-electro-thermal monitoring of studied devices was used to support the proof of concept. This viable method can be integrated into current industrial packaging processes.en_US
dc.language.isoengen_US
dc.publisherIEEEen_US
dc.relation.ispartofIEEE Transactions on Electron Devices
dc.rightsrestrictedAccess
dc.titleEffect of phase change materials on the optical path of LEDs for opto-thermal enhancementen_US
dc.typeArticleen_US
dc.peerreviewedyesen_US
dc.publicationstatusPublisheden_US
dc.contributor.departmentÖzyeğin University
dc.contributor.authorID(ORCID 0000-0002-9505-281X & YÖK ID 124782) Arık, Mehmet
dc.contributor.ozuauthorArık, Mehmet
dc.identifier.volume70en_US
dc.identifier.issue5en_US
dc.identifier.startpage2324en_US
dc.identifier.endpage2329en_US
dc.identifier.wosWOS:001061006900025
dc.identifier.doi10.1109/TED.2023.3248524en_US
dc.subject.keywordsHeat dissipationen_US
dc.subject.keywordsLight-emitting diodes (LEDs)en_US
dc.subject.keywordsPhase change material (PCM)en_US
dc.subject.keywordsThermal quenchingen_US
dc.identifier.scopusSCOPUS:2-s2.0-85153335676
dc.relation.publicationcategoryArticle - International Refereed Journal - Institutional Academic Staff


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record


Share this page