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dc.contributor.authorMuslu, Ahmet Mete
dc.contributor.authorÖzlük, Burak
dc.contributor.authorArık, Mehmet
dc.date.accessioned2022-08-16T11:07:51Z
dc.date.available2022-08-16T11:07:51Z
dc.identifier.issn1043-7398en_US
dc.identifier.urihttp://hdl.handle.net/10679/7811
dc.identifier.urihttps://asmedigitalcollection.asme.org/electronicpackaging/article-abstract/143/1/011007/1084099/An-Investigation-Into-the-Optothermal-Behavior-of?redirectedFrom=fulltext
dc.description.abstractMonochromatic light emitting diodes (LEDs) are getting more attention day by day for a very wide range of applications such as general lighting, signage, automotive lighting, display, water purification, and skin imaging. While they are taking place in a large number of applications, thermal challenges associated with the operation of LEDs have become a significant issue to address since their performance is greatly affected by thermal conditions. Thus, this study focuses on identifying thermal, optical, and electrical characteristics of an AlGaInP-based red LED considering the impact of the LED dome on the chip performance. The junction temperature measurement results obtained with forward voltage change method were validated with thermal imaging method (TIM) and computational models. It was observed that the LED dome may critically affect the thermal, optical, and electrical behaviors of the LED chip. In fact, a 3.7% increase in junction temperature and a 6.1% drop in optical conversion efficiency were found at the normal operation of the red LED after the LED dome was removed. The results were also compared with a blue LED, and lower junction temperatures were measured for the red LED at each driving current. The difference in junction temperature became even more noticeable at higher driving currents. Results have shown a good agreement between three different methods with a maximum variation of 6.9%.en_US
dc.description.sponsorshipTÜBİTAK
dc.language.isoengen_US
dc.publisherASMEen_US
dc.relationinfo:turkey/grantAgreement/TUBITAK/217M357
dc.relation.ispartofJournal of Electronic Packaging, Transactions of the ASME
dc.rightsrestrictedAccess
dc.titleAn investigation into the optothermal behavior of a high power red light emitting diode: impact of an optical pathen_US
dc.typeArticleen_US
dc.peerreviewedyesen_US
dc.publicationstatusPublisheden_US
dc.contributor.departmentÖzyeğin University
dc.contributor.authorID(ORCID 0000-0002-9505-281X & YÖK ID 124782) Arık, Mehmet
dc.contributor.ozuauthorArık, Mehmet
dc.identifier.volume143en_US
dc.identifier.issue1en_US
dc.identifier.wosWOS:000613694500003
dc.identifier.doi10.1115/1.4047381en_US
dc.subject.keywordsComputational fluid dynamics (CFD)en_US
dc.subject.keywordsForward voltageen_US
dc.subject.keywordsJunction temperature measurementen_US
dc.subject.keywordsLED domeen_US
dc.subject.keywordsMonochromatic LEDsen_US
dc.subject.keywordsRed LEDen_US
dc.subject.keywordsThermal imagingen_US
dc.identifier.scopusSCOPUS:2-s2.0-85087548833
dc.contributor.ozugradstudentMuslu, Ahmet Mete
dc.contributor.ozugradstudentÖzlük, Burak
dc.relation.publicationcategoryArticle - International Refereed Journal - Institutional Academic Staff and Graduate Student


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