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Understanding selectivity on Germanium/SiO2 chemical mechanical planarization through design of experiments
(Cambridge University Press, 2015)
The continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization ...
Particle size analysis on wide size distribution powders; effect of sampling and characterization technique
(Elsevier, 2015-01)
Particle size distribution of powders plays a very important role in determining the critical chemical and physical properties of the particulate systems. Precise determination of particle size distribution depends on ...
Chemical mechanical planarization studies on gallium nitride for improved performance
(IEEE, 2015)
In this study, a systematic experimental approach has been followed to determine the conditions to promote material removal rate while controlling surface defectivity for GaN CMP. Silica based slurries were used to optimize ...
Chemical mechanical polishing implementation on dental implants
(IEEE, 2015)
In this study, chemical mechanical polishing (CMP) technique is introduced as a new alternative to generate controlled nano/micro scale roughness on the titanium implant surfaces. It is known that micro scale patterns ...
Characterization of nano-scale protective oxide films: application on metal chemical mechanical planarization
(The Electrochemical Society, 2015)
This study focuses on the characterization of nano-scale metal oxide films for chemical mechanical planarization (CMP) applications. The protective nature of the self-grown metal oxide layers in the CMP slurry environment ...
Nano-boron as an antibacterial agent for functionalized textiles
(Cambridge University Press, 2015-01)
The antibacterial properties of boron-containing compounds are well known although there are limited studies available on the pure boron nanoparticles. In this study boron nano-particles were characterized in terms of their ...
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