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A Cahn-Hilliard modeling of metal oxide thin films for advanced CMP applications
(ECS, 2014)
Chemical mechanical planarization (CMP) process enables topographic selectivity through formation of a protective oxide thin film on the recessed locations of the deposited metal layer, while a continuous chemical oxidation ...
A modeling study on the layout impact of with-in-die thickness range for STI CMP
(ECS, 2013)
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
Optimized process and tool design for gan chemical mechanical planarization
(The Electrochemical Society, 2017-10-04)
In this paper, we present a systematic approach to the gallium nitride (GaN) chemical mechanical planarization (CMP) process through evaluating the effect of crystallographic orientation, slurry chemistry and process ...
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