Search
Now showing items 1-9 of 9
A new model for predicting the required pressure difference for pressure swirl atomizers
(Europe, Institute for Liquid Atomization and Spray Systems, ILASS, 2020)
Prior to this study an investigation is made to analyze the accuracies of the semi-empirical correlations of the previous studies by comparing them with a large number of experimental data which is extracted from the works ...
Fluid flow characteristics inside convergent, divergent and straight open-end pressure swirl atomizer
(Europe, Institute for Liquid Atomization and Spray Systems, ILASS, 2020)
Effects of geometrical parameters on the performance of small-scale open-end pressure swirl atomizers (PSA) have been studied using computational fluid dynamics. The shape of the swirl chamber is the main geometrical feature ...
A coupled material removal model for chemical mechanical polishing processes
(IOP Publishing, 2021-10-01)
Chemical mechanical polishing (CMP) is a process used to obtain planarized surfaces in microelectronic device manufacturing. The planarization is achieved by material removal from the wafer surface by synergistic effect ...
Effect of the motion pattern on the turbulence generated by an active grid
(Springer, 2021)
In the field of turbulence research, many experiments are performed using turbulence generated under reproducible conditions. In the past mostly static grids having a fixed blockage were adopted, but in order to generate ...
Benchmark study of 2D and 3D VOF simulations of a simplex nozzle using a hybrid RANS-LES approach
(Elsevier, 2022-07-01)
In this study, a simplex nozzle is tested with water for the benchmarking of different flow simulation models. A large scale Plexi-glass transparent nozzle is used to reduce the influence of production tolerances on the ...
Model-based optimization of CMP process parameters for uniform material removal selectivity in cu/barrier planarization
(IOP Publishing, 2022-02-01)
Chemical mechanical planarization is a process of achieving planar surfaces in the semiconductor manufacturing industry. The planarization of a surface is achieved by material removal from the wafer surface. The material ...
3D simulation of droplet impact on static and moving walls
(Begell House Inc., 2022)
In the present study, the contact angle model and the origin of the parasitic current, precisely, the relation of the parasitic current with grid distribution, have been studied to accurately predict droplet impact on ...
Validation and comparison of 2D and 3D numerical simulations of flow in simplex nozzles
(Europe, Institute for Liquid Atomization and Spray Systems, ILASS, 2021-08-31)
Numerical simulations of pressure swirl atomizers are computationally expensive due to transient and multiphase flow behavior. In this study, 2D and 3D VOF simulations are performed for a geomerty which has high swirl ...
The effect of interface gradient distribution on unrealistic flow in 3D droplet simulations
(Europe, Institute for Liquid Atomization and Spray Systems, ILASS, 2021-08-31)
The purpose of this study is to investigate the origin of the parasitic current to provide accurate prediction of droplet surface interactions in Volume of Fluid (VOF) framework. The deformation of the droplet due to ...
Share this page