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Boiling heat transfer enhancement of magnetically actuated nanofluids
(AIP, 2013)
Nanofluids offer a potential breakthrough as next-generation heat transfer fluids since they offer exciting new possibilities to enhance heat transfer performance compared to pure liquids. A major drawback for using ...
Steady and unsteady air impingement heat transfer for electronics cooling applications
(ASME, 2013)
This paper focuses on two forced convection methods—steady jet flow and pulsating flow by synthetic jets—that can be used in applications requiring significant amounts of heat removal from electronics components. Given the ...
A numerical study of a single unsteady laminar slot jet in a confined structure
(ASME, 2013)
With the inherit advantages of air cooling, jet impingement can produce a factor of two or higher heat transfer than conventional fan flow over bodies. Therefore, impinging jets can solve a number of electronics thermal ...
Global existence and blow-up of solutions for a general class of doubly dispersive nonlocal nonlinear wave equations
(Elsevier, 2013-01)
This study deals with the analysis of the Cauchy problem of a general class of nonlocal nonlinear equations modeling the bi-directional propagation of dispersive waves in various contexts. The nonlocal nature of the problem ...
A modeling study on the layout impact of with-in-die thickness range for STI CMP
(ECS, 2013)
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
Impact of pad conditioning on thickness profile control in chemical mechanical planarization
(Springer Science+Business Media, 2013-01)
Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
High temperature deformation behavior of 4340 steel: activation energy calculation and modeling of flow
(Elsevier, 2013-12)
The 4340 steel is extensively utilized in several industries including automotive and aerospace for manufacturing a large number of structural components. Due to the importance of thermo-mechanical processing in the ...
Studies on slurry design fundamentals for advanced CMP applications
(ECS, 2013)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables ...
Surfactant mediated slurry formulations for Ge CMP applications
(Cambridge University Press, 2013)
In this study, slurry formulations in the presence of self-assembled surfactant structures were investigated for Ge/SiO2 CMP applications in the absence and presence of oxidizers. Both anionic (sodium dodecyl sulfate-SDS) ...
Metal oxide nano film characterization for CMP optimization
(ECS, 2013)
This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin films forming as a result of the chemical component of the process. Tungsten ...
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