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A Cahn-Hilliard modeling of metal oxide thin films for advanced CMP applications
(ECS, 2014)
Chemical mechanical planarization (CMP) process enables topographic selectivity through formation of a protective oxide thin film on the recessed locations of the deposited metal layer, while a continuous chemical oxidation ...
Understanding selectivity on Germanium/SiO2 chemical mechanical planarization through design of experiments
(Cambridge University Press, 2015)
The continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization ...
Studies on slurry design fundamentals for advanced CMP applications
(ECS, 2013)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables ...
Surfactant mediated slurry formulations for Ge CMP applications
(Cambridge University Press, 2013)
In this study, slurry formulations in the presence of self-assembled surfactant structures were investigated for Ge/SiO2 CMP applications in the absence and presence of oxidizers. Both anionic (sodium dodecyl sulfate-SDS) ...
Improving selectivity on germanium CMP applications
(ECS, 2014)
In the presented paper, the adsorption characteristics of cationic and anionic surfactants on germanium and silica were studied in order to improve selectivity in germanium based shallow trench isolation chemical mechanical ...
Metal oxide nano film characterization for CMP optimization
(ECS, 2013)
This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin films forming as a result of the chemical component of the process. Tungsten ...
Photocatalytic and antibacterial functionality evaluation of nanoboron coated textiles
(2016-09-01)
Antibacterial properties of boron-containing compounds are well known although studies available on pure boron nanoparticles are relatively limited. In the present study, we examine the feasibility of the application of ...
Controlling germanium CMP selectivity through slurry mediation by surface active agents
(The Electrochemical Society, 2015-08-10)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials to semiconductor manufacturing ...
An active brace for controlled transdermal drug delivery for adjustable physical therapy
(IEEE, 2014)
This study presents an active brace which is a cost efficient precision-controlled advanced therapy medicinal product for time and rate controlled transdermal drug delivery (TDD) through the use of drug containing nanoparticles ...
Advanced slurry formulations for new generation chemical mechanical planarization (CMP) applications
(Cambridge University Press, 2012-01)
Chemical Mechanical Planarization (CMP) is widely used to ensure planarity of metal and dielectric surfaces to enable photolithography and hence multilevel metallization in microelectronics manufacturing. The aim of this ...
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