Browsing Mechanical Engineering by Subject "Pad profile modeling"
Now showing items 1-1 of 1
-
Impact of pad conditioning on thickness profile control in chemical mechanical planarization
(Springer Science+Business Media, 2013-01)Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
Share this page