Browsing Mechanical Engineering by Subject "Diffusion"
Now showing items 1-1 of 1
-
A coupled material removal model for chemical mechanical polishing processes
(IOP Publishing, 2021-10-01)Chemical mechanical polishing (CMP) is a process used to obtain planarized surfaces in microelectronic device manufacturing. The planarization is achieved by material removal from the wafer surface by synergistic effect ...
Share this page