Browsing Electrical & Electronics Engineering by Subject "3D on-chip communications"
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MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer
(Association for Computing Machinery, Inc, 2018-05-08)On-chip computing platforms have bottlenecks including cost and physical limits of scaling transistors, communication bottleneck, energy efficiency and speed costs for memory. Three dimensional (3D) design, carbon nanotube ...
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