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dc.contributor.authorArık, Mehmet
dc.contributor.authorSharma, R.
dc.contributor.authorLustbader, J.
dc.contributor.authorHe, X.
dc.date.accessioned2014-07-02T13:21:43Z
dc.date.available2014-07-02T13:21:43Z
dc.date.issued2013
dc.identifier.issn1528-8943
dc.identifier.urihttp://hdl.handle.net/10679/414
dc.identifier.urihttp://heattransfer.asmedigitalcollection.asme.org/article.aspx?articleid=1742215
dc.descriptionDue to copyright restrictions, the access to the full text of this article is only available via subscription.en_US
dc.description.abstractThis paper focuses on two forced convection methods—steady jet flow and pulsating flow by synthetic jets—that can be used in applications requiring significant amounts of heat removal from electronics components. Given the dearth of available data, we have experimentally investigated steady jets and piezoelectrically driven synthetic jets that provide pulsating flow of air at a high coefficient of performance. To mimic a typical electronics component, a 25.4-mm × 25.4-mm vertical heated surface was used for heat removal. The impingement heat transfer, in the form of Nusselt number, is reported for both steady and unsteady jets over Reynolds numbers from 100 to 3000. The effect of jet-to-plate surface distance on the impingement heat transfer is also investigated. Our results show that synthetic jets can provide significantly higher cooling than steady jets in the Reynolds number range of 100 to 3000. We attribute the superior performance of synthetic jets to vortex shedding associated with the unsteady flow.en_US
dc.language.isoengen_US
dc.publisherASMEen_US
dc.relation.ispartofJournal of Heat Transfer
dc.rightsrestrictedAccess
dc.titleSteady and unsteady air impingement heat transfer for electronics cooling applicationsen_US
dc.typeArticleen_US
dc.peerreviewedyesen_US
dc.publicationstatuspublisheden_US
dc.contributor.departmentÖzyeğin University
dc.contributor.authorID(ORCID 0000-0002-9505-281X & YÖK ID 124782) Arık, Mehmet
dc.contributor.ozuauthorArık, Mehmet
dc.identifier.volume135
dc.identifier.issue11
dc.identifier.wosWOS:000326170500010
dc.identifier.doi10.1115/1.4024614
dc.subject.keywordsHeat transferen_US
dc.subject.keywordsReynolds numberen_US
dc.subject.keywordsJetsen_US
dc.subject.keywordsCoolingen_US
dc.subject.keywordsTemperatureen_US
dc.subject.keywordsComputer coolingen_US
dc.identifier.scopusSCOPUS:2-s2.0-84886388797
dc.contributor.authorMale1
dc.relation.publicationcategoryArticle - International Refereed Journal - Institutional Academic Staff


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