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Benchmarking nonlinear optimization software in technical computing environments
(Springer Science+Business Media, 2013-04)
Our strategic objective is to develop a broadly categorized, expandable collection of test problems, to support the benchmarking of nonlinear optimization software packages in integrated technical computing environments ...
VRP12 (vehicle routing problem with distances one and two) with side constraints
(Elsevier, 2013-08)
The problem undertaken in this study is inspired from a real life application. Consider a vehicle routing problem where the distances between the customer locations are either one or two. We name this problem as VRP12 in ...
DAPNA: an architectural framework for data processing networks
(Springer Science+Business Media, 2013)
A data processing network is as a set of (software) components connected through communication channels to apply a series of operations on data. Realization and maintenance of large-scale data processing networks necessitate ...
A modeling study on the layout impact of with-in-die thickness range for STI CMP
(ECS, 2013)
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
Impact of pad conditioning on thickness profile control in chemical mechanical planarization
(Springer Science+Business Media, 2013-01)
Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
High temperature deformation behavior of 4340 steel: activation energy calculation and modeling of flow
(Elsevier, 2013-12)
The 4340 steel is extensively utilized in several industries including automotive and aerospace for manufacturing a large number of structural components. Due to the importance of thermo-mechanical processing in the ...
Studies on slurry design fundamentals for advanced CMP applications
(ECS, 2013)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables ...
Metal oxide nano film characterization for CMP optimization
(ECS, 2013)
This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin films forming as a result of the chemical component of the process. Tungsten ...
Multiplicity and transverse momentum dependence of two- and four-particle correlations in pPb and PbPb collisions
(Elsevier, 2013-07-23)
Measurements of two- and four-particle angular correlations for charged particles emitted in pPb collisions are presented over a wide range in pseudorapidity and full azimuth. The data, corresponding to an integrated ...
Search for gluino mediated bottom- and top-squark production in multijet final states in pp collisions at 8 TeV
(Elsevier, 2013-10)
A search for supersymmetry is presented based on events with large missing transverse energy, no isolated electron or muon, and at least three jets with one or more identified as a bottom-quark jet. A simultaneous examination ...
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