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Studies on slurry design fundamentals for advanced CMP applications
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables ...
Characterization of chemically modified thin films for optimization of metal CMP applications?
(Cambridge University Press, 2013)
Metal CMP applications necessitate the formation of a protective oxide film in the presence of surface active agents, oxidizers, pH regulators and other chemicals to achieve global planarization. Formation and mechanical ...
Metal oxide nano film characterization for CMP optimization
This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin films forming as a result of the chemical component of the process. Tungsten ...
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