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A coupled material removal model for chemical mechanical polishing processes
(IOP Publishing, 2021-10-01)
Chemical mechanical polishing (CMP) is a process used to obtain planarized surfaces in microelectronic device manufacturing. The planarization is achieved by material removal from the wafer surface by synergistic effect ...
Model-based optimization of CMP process parameters for uniform material removal selectivity in cu/barrier planarization
(IOP Publishing, 2022-02-01)
Chemical mechanical planarization is a process of achieving planar surfaces in the semiconductor manufacturing industry. The planarization of a surface is achieved by material removal from the wafer surface. The material ...
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