Search
Now showing items 81-90 of 201
Experiences on the road from EDA developer to designer to educator
(IEEE, 2013)
This paper will coin some concepts that came to being as an engineer once made a journey from EDA developer of a behavioral synthesis tool to RTL designer and then on to academia. The EDA developer in disguise of logic ...
Measurement of neutral strange particle production in the underlying event in proton-proton collisions at root s=7 TeV
(American Physical Society, 2013-09-01)
Measurements are presented of the production of primary K-S(0) and Lambda particles in proton-proton collisions at root s = 7 TeV in the region transverse to the leading charged-particle jet in each event. The average ...
Global existence and blow-up of solutions for a general class of doubly dispersive nonlocal nonlinear wave equations
(Elsevier, 2013-01)
This study deals with the analysis of the Cauchy problem of a general class of nonlocal nonlinear equations modeling the bi-directional propagation of dispersive waves in various contexts. The nonlocal nature of the problem ...
Benchmarking nonlinear optimization software in technical computing environments
(Springer Science+Business Media, 2013-04)
Our strategic objective is to develop a broadly categorized, expandable collection of test problems, to support the benchmarking of nonlinear optimization software packages in integrated technical computing environments ...
VRP12 (vehicle routing problem with distances one and two) with side constraints
(Elsevier, 2013-08)
The problem undertaken in this study is inspired from a real life application. Consider a vehicle routing problem where the distances between the customer locations are either one or two. We name this problem as VRP12 in ...
DAPNA: an architectural framework for data processing networks
(Springer Science+Business Media, 2013)
A data processing network is as a set of (software) components connected through communication channels to apply a series of operations on data. Realization and maintenance of large-scale data processing networks necessitate ...
A modeling study on the layout impact of with-in-die thickness range for STI CMP
(ECS, 2013)
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
Impact of pad conditioning on thickness profile control in chemical mechanical planarization
(Springer Science+Business Media, 2013-01)
Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
High temperature deformation behavior of 4340 steel: activation energy calculation and modeling of flow
(Elsevier, 2013-12)
The 4340 steel is extensively utilized in several industries including automotive and aerospace for manufacturing a large number of structural components. Due to the importance of thermo-mechanical processing in the ...
Studies on slurry design fundamentals for advanced CMP applications
(ECS, 2013)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables ...
Share this page