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A Cahn-Hilliard modeling of metal oxide thin films for advanced CMP applications
(ECS, 2014)
Chemical mechanical planarization (CMP) process enables topographic selectivity through formation of a protective oxide thin film on the recessed locations of the deposited metal layer, while a continuous chemical oxidation ...
A modeling study on the layout impact of with-in-die thickness range for STI CMP
(ECS, 2013)
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
Tailoring silica nanotribology for CMP slurry optimization: Ca2+ cation competition in C12TAB mediated lubrication
(ACS, 2010-04-12)
Self-assembled surfactant structures at the solid/liquid interface have been shown to act as nanoparticulate dispersants and are capable of providing a highly effective, self-healing boundary lubrication layer in aqueous ...
Impact of pad conditioning on thickness profile control in chemical mechanical planarization
(Springer Science+Business Media, 2013-01)
Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
Understanding selectivity on Germanium/SiO2 chemical mechanical planarization through design of experiments
(Cambridge University Press, 2015)
The continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization ...
Studies on slurry design fundamentals for advanced CMP applications
(ECS, 2013)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables ...
Surfactant mediated slurry formulations for Ge CMP applications
(Cambridge University Press, 2013)
In this study, slurry formulations in the presence of self-assembled surfactant structures were investigated for Ge/SiO2 CMP applications in the absence and presence of oxidizers. Both anionic (sodium dodecyl sulfate-SDS) ...
Improving selectivity on germanium CMP applications
(ECS, 2014)
In the presented paper, the adsorption characteristics of cationic and anionic surfactants on germanium and silica were studied in order to improve selectivity in germanium based shallow trench isolation chemical mechanical ...
Metal oxide nano film characterization for CMP optimization
(ECS, 2013)
This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin films forming as a result of the chemical component of the process. Tungsten ...
Photocatalytic and antibacterial functionality evaluation of nanoboron coated textiles
(2016-09-01)
Antibacterial properties of boron-containing compounds are well known although studies available on pure boron nanoparticles are relatively limited. In the present study, we examine the feasibility of the application of ...
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