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Surface characterization driven CMP optimization for gallium nitride
(ECS, 2016)
Gallium nitride is a hard and chemically inert material demoting high material removal rates in the chemical mechanical planarization (CMP) applications. This paper focuses on the optimization of the process conditions to ...
Effect of slurry aging on stability and performance of chemical mechanical planarization process
(Elsevier, 2011-03)
Chemical mechanical planarization (CMP) is known to be one of the most challenging processes in microelectronics manufacturing due to the number of variables involved in the design of the process. In particular, the slurries ...
Particle size analysis on wide size distribution powders; effect of sampling and characterization technique
(Elsevier, 2015-01)
Particle size distribution of powders plays a very important role in determining the critical chemical and physical properties of the particulate systems. Precise determination of particle size distribution depends on ...
Development of 3-D chemical mechanical polishing process for nanostructuring of bioimplant surfaces
(ECS, 2014)
This study focuses on the development of a three dimensional chemical mechanical polishing (CMP) process to induce smoothness or controlled nano-roughness on the bio-implant material surfaces, particularly for an application ...
An active brace for controlled transdermal drug delivery for adjustable physical therapy
(IEEE, 2014)
This study presents an active brace which is a cost efficient precision-controlled advanced therapy medicinal product for time and rate controlled transdermal drug delivery (TDD) through the use of drug containing nanoparticles ...
Advanced slurry formulations for new generation chemical mechanical planarization (CMP) applications
(Cambridge University Press, 2012-01)
Chemical Mechanical Planarization (CMP) is widely used to ensure planarity of metal and dielectric surfaces to enable photolithography and hence multilevel metallization in microelectronics manufacturing. The aim of this ...
Characterization of chemically modified thin films for optimization of metal CMP applications?
(Cambridge University Press, 2013)
Metal CMP applications necessitate the formation of a protective oxide film in the presence of surface active agents, oxidizers, pH regulators and other chemicals to achieve global planarization. Formation and mechanical ...
Biomaterials applications of chemical mechanical polishing
(IEEE, 2012)
Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness ...
Chemical mechanical planarization studies on gallium nitride for improved performance
(IEEE, 2015)
In this study, a systematic experimental approach has been followed to determine the conditions to promote material removal rate while controlling surface defectivity for GaN CMP. Silica based slurries were used to optimize ...
Chemical mechanical polishing implementation on dental implants
(IEEE, 2015)
In this study, chemical mechanical polishing (CMP) technique is introduced as a new alternative to generate controlled nano/micro scale roughness on the titanium implant surfaces. It is known that micro scale patterns ...
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