Show simple item record

dc.contributor.authorEmir, Tolga
dc.contributor.authorOurabi, H.
dc.contributor.authorBudaklı, M.
dc.contributor.authorArık, Mehmet
dc.date.accessioned2023-06-02T08:30:04Z
dc.date.available2023-06-02T08:30:04Z
dc.date.issued2022-12
dc.identifier.issn1043-7398en_US
dc.identifier.urihttp://hdl.handle.net/10679/8354
dc.identifier.urihttps://asmedigitalcollection.asme.org/electronicpackaging/article/144/4/040801/1139771/Parametric-Effects-on-Pool-Boiling-Heat-Transfer
dc.description.abstractPool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six decades. This paper presents a critical literature review of various parametric effects on pool boiling heat transfer and critical heat flux (CHF) such as pressure, subcooling, surface topography, surface orientation, working fluid, and combined effects. To achieve an optimal heat removal solution for a particular problem, each of these parameters must be understood. The governing mechanisms are discussed separately, and various options related to the selection of appropriate working fluids are highlighted. A broad summary of correlations developed until now for predicting CHF is presented with their ranges of validity. While proposed correlations for predicting CHF have been quite promising, they still have a considerable uncertainty (625%). Finally, a correlation proposed by Professor Avram Bar-Cohen and his team (thermal management of electronics (TME) correlation) is compared with the experimental dataset published in previous studies. It shows that the uncertainty band can be further narrowed down to 612.5% for dielectric liquids by using TME correlation. Furthermore, this correlation has been enhanced to predict CHF values underwater above 50 W/cm2 by applying a genetic algorithm, and new perspectives for possible future research activities are proposed.en_US
dc.description.sponsorshipDeutsche Forschungsgemeinschaft ; EVATEG Research Center at Ozyegin University
dc.language.isoengen_US
dc.publisherASMEen_US
dc.relation.ispartofJournal of Electronic Packaging, Transactions of the ASME
dc.rightsrestrictedAccess
dc.titleParametric effects on pool boiling heat transfer and critical heat flux: A critical reviewen_US
dc.typeArticleen_US
dc.peerreviewedyesen_US
dc.publicationstatusPublisheden_US
dc.contributor.departmentÖzyeğin University
dc.contributor.authorID(ORCID 0000-0002-9505-281X & YÖK ID 124782) Arık, Mehmet
dc.contributor.ozuauthorArık, Mehmet
dc.identifier.volume144en_US
dc.identifier.issue4en_US
dc.identifier.wosWOS:000881929900012
dc.identifier.doi10.1115/1.4054184en_US
dc.identifier.scopusSCOPUS:2-s2.0-85144583471
dc.contributor.ozugradstudentEmir, Tolga
dc.relation.publicationcategoryArticle - International Refereed Journal - Institutional Academic Staff and Graduate Student


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record


Share this page