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dc.contributor.authorTarçın, Hüseyin Gökberk
dc.contributor.authorSaygın, Alper
dc.contributor.authorMuslu, Ahmet Mete
dc.contributor.authorBudakli, M.
dc.contributor.authorArık, Mehmet
dc.date.accessioned2021-06-14T10:28:58Z
dc.date.available2021-06-14T10:28:58Z
dc.date.issued2020
dc.identifier.isbn978-172819764-7
dc.identifier.urihttp://hdl.handle.net/10679/7431
dc.identifier.urihttps://ieeexplore.ieee.org/document/9190588
dc.description.abstractSince many industrial applications require heat treatment processes or validation tests under certain ambient temperatures, thermal design is a key issue to be considered in order to ensure fast heating and cooling capabilities. Although most industrial furnaces provide the required isothermal conditions for various test applications or calibrations, a number of them does not provide rapid heating and cooling inside a closed system and the thermal equilibrium over different regions of the system are not satisfied as intended. This brings a number of challenges for the performance test of most electronics, which are affected by ambient temperatures, such as LEDs, lasers and transistors. Particularly, a test environment that can quickly and accurately adjust a uniformly distributed isothermal domain can be useful for many electronic components in order to test their performance at preselected ambient temperatures. In such systems, the design parameters have to be adjusted depending on the desired conditions. In fact, the design of those systems has to be planned in detail to achieve a system working fast and accurate, which shall contribute to reduction in operating time. Therefore, this study focuses on proposing a new approach to the development of a high-performance and high-resolution heating and cooling chamber used in a junction temperature measurement of light emitting diodes (LEDs). The major objective thereby is to achieve high heating and cooling rates of a controlled chamber that satisfies thermal conditions at a user defined temperature interval between 20°C and 80°C. Therefore, material properties and geometrical dimensions, power requirements and cooling performances of the chamber are analyzed as major design parameters. Numerical models are created for various design options, and simulations are performed for various working conditions under certain design constraints. The relationships between design parameters are determined. A final design is propos...en_US
dc.language.isoengen_US
dc.publisherIEEEen_US
dc.relationinfo:turkey/grantAgreement/TUBITAK/217M357
dc.relation.ispartof2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
dc.rightsrestrictedAccess
dc.titleRapid heating and cooling chamber for a photonics junction measurement systemen_US
dc.typeConference paperen_US
dc.publicationstatusPublisheden_US
dc.contributor.departmentÖzyeğin University
dc.contributor.authorID(ORCID 0000-0002-9505-281X & YÖK ID 124782) Arık, Mehmet
dc.contributor.ozuauthorArık, Mehmet
dc.identifier.startpage267
dc.identifier.endpage275
dc.identifier.wosWOS:000701365300037
dc.identifier.doi10.1109/ITherm45881.2020.9190588en_US
dc.subject.keywordsPhotonicsen_US
dc.subject.keywordsThermal designen_US
dc.subject.keywordsJunction temperature measurementen_US
dc.subject.keywordsForward voltage methoden_US
dc.subject.keywordsLight emitting diodesen_US
dc.identifier.scopusSCOPUS:2-s2.0-85091768921
dc.contributor.ozugradstudentTarçın, Hüseyin Gökberk
dc.contributor.ozugradstudentSaygın, Alper
dc.contributor.ozugradstudentMuslu, Ahmet Mete
dc.relation.publicationcategoryConference Paper - International - Institutional Academic Staff, Graduate Student and Undergraduate Student


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