Browsing Mechanical Engineering by Title
Now showing items 274-293 of 465
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Low-cycle fatigue behavior of friction stir-welded copper joints
(Springer, 2021-11)Investigation of the fatigue response of friction stir-welded (FSWed) joints is especially important in the design and manufacturing of components with exposure to cyclic loading. In this study, cyclic response of FSWed ... -
Low-loss optical switch using Brewster angle
(IEEE, 2011)Fabrication and actuation errors of submicron silicon waveguide optical switches are reported to remain within sub-100 nm ranges. These errors cause high loss ruining the optical performance of the switches at the on-state. ... -
Lower uncertainty bounds of diffraction-based nanoparticle sizes
(Wiley, 2022-06)A self-consistent analysis is reported of traditional diffraction-based particle size determination techniques applied to synthetic diffraction profiles generated with the Patterson approach. The results show that dimensions ... -
Machine learning to predict junction temperature based on optical characteristics in solid-state lighting devices: A test on WLEDs
(MDPI, 2022-08)While junction temperature control is an indispensable part of having reliable solid-state lighting, there is no direct method to measure its quantity. Among various methods, temperature-sensitive optical parameter-based ... -
Manufacturing and mechanical behavior of titanium-steel composite by accumulative roll bonding
(Trans Tech Publications Ltd, 2021)Metal matrix composites have attracted interest for use in several engineering applications and this study focuses on the fabrication titanium and interstitial free steel composite and its mechanical performance. Accumulative ... -
Mars gezgini prototipi Merih-2
(Gazi Üniversitesi, 2018-12)Merih-2, Özyeğin Üniversitesi Rover Takımı tarafından University Rover Challenge 2016 ve European Rover Challenge 2016’ya katılmak ve Mars koşullarında görev yapmak için tasarlanan gezgindir. Sürüş için Merih-2’nin 6 adet ... -
Mass flow rate control of solenoid-based injectors
(Sage, 2023-09)This paper presents a mass flow rate control method for solenoid-based injectors in open-loop, i.e. without physical sensor feedback. Measuring the mass flow rate in injectors is important because the performance of the ... -
Materials for radiative cooling: a review
(Elsevier, 2017)Buildings use more than one-third of the total energy consumed in counties within the Mediterranean climate zones like in Turkey. During the summer months, the absorption of solar energy by the buildings increases the ... -
Mechanical and wear properties of ultrafine-grained pure Ti produced by multi-pass equal-channel angular extrusion
(Elsevier, 2009-08-20)In this study, pure grade 2 Ti was processed via equal-channel angular extrusion (ECAE) for 8 and 12 passes following route-E at 300 °C. After processing, the microstructural evolution, tensile properties and wear behavior ... -
Mechanical behavior of constrained groove pressed stainless steel and pure zinc
(Trans Tech Publications Ltd, 2021)Constrained groove pressing (CGP), a severe plastic deformation method, has been implemented on AISI 304 and commercially pure zinc samples in the present work. Four CGP passes were successfully applied to both materials ... -
Metal CMP optimization based on chemically formed thin film analysis
(The Electrochemical Society, 2009)The conventional demands for development in semiconductor industry are changing as the Moore's Law is approaching to its limits. This paper demonstrates a theoretical optimization approach for the planarization of metal ... -
Metal oxide nano film characterization for CMP optimization
(ECS, 2013)This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin films forming as a result of the chemical component of the process. Tungsten ... -
Metal oxide thin film characterization for new generation chemical mechanical planarization development
(The Electrochemical Society, 2016)This study targets to create a basis for the process development in the new generation semiconductor industry dealing with atomic scale devices. We focus on the CMP process development as it is used for the current and ... -
A methodology to design multi-axis test rigs for vibration and durability testing using frequency response functions
(2017-06-25)The multi-axis simulators are designed for experimental verification of the safe functioning of large components and subsystems under real world customer usage in vibration and durability testing. Transformation of the ... -
A methodology to optimize damping pad application on a complex structure using finite element models
(International Institute of Acoustics and Vibration, IIAV, 2018)Passive constrained layer damping patches have been extensively used for vibration and acoustics applications due to their capability to dissipate vibrational energy into heat. In this study, we perform an optimization ... -
Micro-hydrodynamic interaction mechanisms in tio2 nano-colloidal suspensions with different particle size distributions: the effects of electrostatic and steric stabilization
(Bangladesh University of Engineering and Technology, 2020)Micro-hydrodynamic interaction mechanisms of colloidal particles have important effects on the intrinsic properties and behavior of nano-colloidal suspensions, which in turn affect their different potential applications. ... -
Microstructural examination of black seawater mixed sulfate-resistant cement concrete
(ASCE, 2024-01-01)The use of seawater as the mix water has been thought to be inevitable for the near future as a result of increasing water scarcity. Hundreds of papers related to seawater mixed cement-based materials were published in ... -
Modal characterization of additively manufactured TPMS structures: comparison between different modeling methods
(Springer Nature, 2020-10-14)The use of lattice structures has received increasing interest in various engineering applications owing to their high strength to weight ratio. Advances in additive manufacturing technologies enabled the manufacturing of ... -
A model of chemical mechanical planarization to predict impact of pad conditioning on process performance
(Cambridge University Press, 2012)This study presents an effort to couple a wafer removal rate profile model based on the locally relevant Preston equation to the change in pad thickness profile which reflects to post polish profile of the wafers after ... -
Model-based optimization of CMP process parameters for uniform material removal selectivity in cu/barrier planarization
(IOP Publishing, 2022-02-01)Chemical mechanical planarization is a process of achieving planar surfaces in the semiconductor manufacturing industry. The planarization of a surface is achieved by material removal from the wafer surface. The material ...
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