Başım, Gül BaharÖzdemir, ZeynepMutlu, Ö.2016-02-172016-02-172012978-3-8007-3452-8http://hdl.handle.net/10679/2788Due to copyright restrictions, the access to the full text of this article is only available via subscription.Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a controlled manner. As an alternative technique to sand-blasting/etching or laser structuring on the implant surfaces, CMP results in formation of a protective oxide layer on the titanium surfaces that can limit surface contamination while enabling surface nano-structuring that is known to promote bioactivity. Keywords: CMP, Titanium Implants, Biomaterials, Micro-Patterning.engrestrictedAccessconferenceObject15CMPTitanium implantsBiomaterialsMicro-patterning