Hodes, M. S.Iyengar, M.Arık, MehmetKim, K. J.Spector, M.Bhavnani, S. H.Joshi, Y. K.Mahajan, R. V.Ramakrishna, K.2023-05-032023-05-032021-082156-3950http://hdl.handle.net/10679/8169The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].engrestrictedAccessBiographical-Item11811531155000685887800006