In memoriam Prof. Avram Bar-Cohen

Abstract

It has been a little over a year since the passing of Prof. Avram, Avi as he is popularly known, Bar-Cohen. Eulogies from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging still continue to come in. His impact on the electronic packaging community in general and thermal management community, in particular, is profound. The IEEE ITherm Conference renamed Best Paper awards in his honor. The ASME InterPACK Conference renamed its Achievement Award to honor him and is working diligently to elevate it from a Divisional Award to a Society-Level Award. The ASME Journal of Electronic Packaging will be publishing a Special Issue, edited mostly by his former students, in December 2021.