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A modeling study on the layout impact of with-in-die thickness range for STI CMP
(ECS, 2013)
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
A torque matched aerodynamic performance analysis method for the horizontal axis wind turbines
(Wiley, 2013-11)
An analysis method is developed to test the operational performance of a horizontal axis wind turbines. The rotor is constrained to the torque–speed characteristic of the coupled generator. Therefore, the operational ...
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