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Controlling germanium CMP selectivity through slurry mediation by surface active agents
(The Electrochemical Society, 2015-08-10)
New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials to semiconductor manufacturing ...
A fundamental approach to electrochemical analyses on chemically modified thin films for barrier CMP optimization
(IOP Publishing, 2019-04-09)
Chemical Mechanical Planarization (CMP) process development for 10nm nodes and beyond demands a systematic understanding of atomic-scale chemical and mechanical surface interactions for the control of material removal, ...
The photocatalytic effects of textile materials treated with TiO2 and Fe/TiO2
(Institutul Naţional de Cercetare-Dezvoltare pentru Textile şi Pielărie, 2015)
The research has been focused on the photocatalytic activity of the textile materials treated with TiO2 and TiO2 iron doped by pad-dry-cure and cationization - pad-dry-cure. The fabrics have been exposed to UV and visible ...
Optimized process and tool design for gan chemical mechanical planarization
(The Electrochemical Society, 2017-10-04)
In this paper, we present a systematic approach to the gallium nitride (GaN) chemical mechanical planarization (CMP) process through evaluating the effect of crystallographic orientation, slurry chemistry and process ...
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