Browsing Mechanical Engineering by Subject "Thin film"
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Advanced slurry formulations for new generation chemical mechanical planarization (CMP) applications (Cambridge University Press, 2012-01)Chemical Mechanical Planarization (CMP) is widely used to ensure planarity of metal and dielectric surfaces to enable photolithography and hence multilevel metallization in microelectronics manufacturing. The aim of this ...
Understanding selectivity on Germanium/SiO2 chemical mechanical planarization through design of experiments (Cambridge University Press, 2015)The continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization ...
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