Browsing Electrical & Electronics Engineering by Subject "3D on-chip communications"
Now showing items 1-1 of 1
MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer (Association for Computing Machinery, Inc, 2018-05-08)On-chip computing platforms have bottlenecks including cost and physical limits of scaling transistors, communication bottleneck, energy efficiency and speed costs for memory. Three dimensional (3D) design, carbon nanotube ...
Share this page