Publication:
A comparative study for the junction temperature of green light-emitting diodes

dc.contributor.authorÖzlük, Burak
dc.contributor.authorMuslu, Ahmet Mete
dc.contributor.authorArık, Mehmet
dc.contributor.departmentMechanical Engineering
dc.contributor.ozuauthorARIK, Mehmet
dc.contributor.ozugradstudentÖzlük, Burak
dc.contributor.ozugradstudentMuslu, Ahmet Mete
dc.date.accessioned2020-06-29T18:10:34Z
dc.date.available2020-06-29T18:10:34Z
dc.date.issued2019-10
dc.description.abstractSolid-state lighting devices offer a wide variety of color options applicable for general and automotive lighting, various display systems, and a number of niche applications. As they get smaller, generated heat fluxes become more intense and induce serious lifetime and performance issues. Although the light output from light-emitting diodes (LEDs) is the most efficient at a narrow optical spectrum compared with conventional lighting sources, they are still not adequate to satisfy consumer demands due to considerable amounts of lost energy and emerging thermal issues. On the other hand, it is possible to achieve effective thermal solutions if the junction temperature of LEDs is precisely determined. A number of techniques have been proposed for the junction temperature measurement of LEDs such as forward voltage change and infrared (IR) thermal imaging. In this study, green LEDs were studied to observe optothermal interactions using a number of proposed junction temperature measurement techniques. The effect of an LED lens on junction temperature and optical extraction was investigated by examining the change in the thermal and optical properties of an LED chip after the LED lens was removed. In addition, the results of the green LED were compared with a 450-nm blue LED and verified with numerical findings. As a result, it has been determined that the thermal behavior of LEDs is significantly affected by electrical conditions, since the junction temperature of green and blue LEDs has risen by around 45% after the operating current has been increased from 200 to 500 mA.en_US
dc.description.sponsorshipTÜBİTAK
dc.identifier.doi10.1109/TCPMT.2019.2929172en_US
dc.identifier.endpage2035en_US
dc.identifier.issn2156-3950en_US
dc.identifier.issue10en_US
dc.identifier.scopus2-s2.0-85073789214
dc.identifier.startpage2024en_US
dc.identifier.urihttp://hdl.handle.net/10679/6663
dc.identifier.urihttps://doi.org/10.1109/TCPMT.2019.2929172
dc.identifier.volume9en_US
dc.identifier.wos000504731100012
dc.language.isoengen_US
dc.peerreviewedyesen_US
dc.publicationstatusPublisheden_US
dc.publisherIEEEen_US
dc.relationinfo:eu-repo/grantAgreement/TUBITAK/1001 - Araştırma/217M357
dc.relation.ispartofIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.relation.publicationcategoryInternational Refereed Journal
dc.rightsrestrictedAccess
dc.subject.keywordsForward voltage techniqueen_US
dc.subject.keywordsGreen light-emitting diode (LED)en_US
dc.subject.keywordsJunction temperature measurementen_US
dc.subject.keywordsLEDen_US
dc.subject.keywordsLED lensen_US
dc.subject.keywordsThermal imagingen_US
dc.titleA comparative study for the junction temperature of green light-emitting diodesen_US
dc.typearticleen_US
dspace.entity.typePublication
relation.isOrgUnitOfPublicationdaa77406-1417-4308-b110-2625bf3b3dd7
relation.isOrgUnitOfPublication.latestForDiscoverydaa77406-1417-4308-b110-2625bf3b3dd7

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