Browsing by Author "Kincal, S."
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Impact of pad conditioning on thickness profile control in chemical mechanical planarization Kincal, S.; Başım, Gül Bahar (Springer Science+Business Media, 2013-01)Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
A model of chemical mechanical planarization to predict impact of pad conditioning on process performance Başım, Gül Bahar; Kincal, S. (Cambridge University Press, 2012)This study presents an effort to couple a wafer removal rate profile model based on the locally relevant Preston equation to the change in pad thickness profile which reflects to post polish profile of the wafers after ...
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