Chemical mechanical planarization (CMP) is known to be one of the most challenging processes in microelectronics manufacturing due to the number of variables involved in the design of the process. In particular, the slurries ...

With the recent advances in consumer and power electronics, efficient thermal management of high heat flux components has taken on new urgency. While its inherent advantages have made air cooling the method of choice for ...

We embark on this preliminary study of the suitability of the discrete dipole approximation with surface interaction (DDA-SI) method to model electric field scattering from noble metal nano-structures on dielectric substrates. ...

Characterization of particles requires detailed understanding of light interaction with homogeneous/inhomogeneous and regular/irregular shaped particles, or fractallike structures, within optically thin or thick media. ...

The possibility of controlling near-field radiative heat transfer with the use of silicon carbide thin films supporting surface phonon–polaritons in the infrared spectrum is explored. For this purpose, the local density ...

We demonstrate the coexistence of different near-field thermal radiation regimes between two layers supporting surface phonon polaritons (SPhPs) in the infrared. These regimes existwhen the distance of separation between ...