Now showing items 1-10 of 19
A numerical study of a single unsteady laminar slot jet in a confined structure
With the inherit advantages of air cooling, jet impingement can produce a factor of two or higher heat transfer than conventional fan flow over bodies. Therefore, impinging jets can solve a number of electronics thermal ...
A torque matched aerodynamic performance analysis method for the horizontal axis wind turbines
An analysis method is developed to test the operational performance of a horizontal axis wind turbines. The rotor is constrained to the torque–speed characteristic of the coupled generator. Therefore, the operational ...
Integrating magnetic heads with plasmonic nanostructures in multilayer configurations
Heat-assisted magnetic recording (HAMR) is an emerging technology that has increased the areal density of conventional recording techniques for hard disc drives. Integrated heads have enabled this increase through localized ...
Steady and unsteady air impingement heat transfer for electronics cooling applications
This paper focuses on two forced convection methods—steady jet flow and pulsating flow by synthetic jets—that can be used in applications requiring significant amounts of heat removal from electronics components. Given the ...
Boiling heat transfer enhancement of magnetically actuated nanofluids
Nanofluids offer a potential breakthrough as next-generation heat transfer fluids since they offer exciting new possibilities to enhance heat transfer performance compared to pure liquids. A major drawback for using ...
Special issue based on the Eurotherm Seminar 95-computational thermal radiation in participating media IV
Global existence and blow-up of solutions for a general class of doubly dispersive nonlocal nonlinear wave equations
This study deals with the analysis of the Cauchy problem of a general class of nonlocal nonlinear equations modeling the bi-directional propagation of dispersive waves in various contexts. The nonlocal nature of the problem ...
A modeling study on the layout impact of with-in-die thickness range for STI CMP
Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
High temperature deformation behavior of 4340 steel: activation energy calculation and modeling of flow
The 4340 steel is extensively utilized in several industries including automotive and aerospace for manufacturing a large number of structural components. Due to the importance of thermo-mechanical processing in the ...
Direct liquid cooling of high flux LED systems: hot spot abatement
With the recent advances in wide band gap device technology, solid-state lighting (SSL) has become favorable for many lighting applications due to energy savings, long life, green nature for environment, and exceptional ...
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