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Tailoring silica nanotribology for CMP slurry optimization: Ca2+ cation competition in C12TAB mediated lubrication
Self-assembled surfactant structures at the solid/liquid interface have been shown to act as nanoparticulate dispersants and are capable of providing a highly effective, self-healing boundary lubrication layer in aqueous ...
Impact of pad conditioning on thickness profile control in chemical mechanical planarization
(Springer Science+Business Media, 2013-01)
Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multilevel metallization. Decreasing device dimensions and increasing wafer sizes continuously ...
Effect of slurry aging on stability and performance of chemical mechanical planarization process
Chemical mechanical planarization (CMP) is known to be one of the most challenging processes in microelectronics manufacturing due to the number of variables involved in the design of the process. In particular, the slurries ...
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