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Optimized process and tool design for gan chemical mechanical planarization
(The Electrochemical Society, 2017-10-04)
In this paper, we present a systematic approach to the gallium nitride (GaN) chemical mechanical planarization (CMP) process through evaluating the effect of crystallographic orientation, slurry chemistry and process ...
Photocatalytic and antibacterial functionality evaluation of nanoboron coated textiles
(2016-09-01)
Antibacterial properties of boron-containing compounds are well known although studies available on pure boron nanoparticles are relatively limited. In the present study, we examine the feasibility of the application of ...
Surface characterization of textiles for optimization of functional polymeric nano-capsule attachment
(Carl Hanser Verlag, 2019-09)
Surface properties of textiles play an essential role in their functionalization with micro/nanometer-sized polymeric capsules containing active agents that can provide controlled release. The attached capsules provide ...
Nano-boron as an antibacterial agent for functionalized textiles
(Cambridge University Press, 2015-01)
The antibacterial properties of boron-containing compounds are well known although there are limited studies available on the pure boron nanoparticles. In this study boron nano-particles were characterized in terms of their ...
Characterization and antibacterial properties of nanoboron powders and nanoboron powder coated textiles
(Elsevier, 2017-02)
The antibacterial properties of boron-containing compounds are well known although there are limited studies available on the pure boron nanoparticles. In this paper, nanoboron particles are characterized in terms of their ...
A coupled material removal model for chemical mechanical polishing processes
(IOP Publishing, 2021-10-01)
Chemical mechanical polishing (CMP) is a process used to obtain planarized surfaces in microelectronic device manufacturing. The planarization is achieved by material removal from the wafer surface by synergistic effect ...
Model-based optimization of CMP process parameters for uniform material removal selectivity in cu/barrier planarization
(IOP Publishing, 2022-02-01)
Chemical mechanical planarization is a process of achieving planar surfaces in the semiconductor manufacturing industry. The planarization of a surface is achieved by material removal from the wafer surface. The material ...
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