A model of chemical mechanical planarization to predict impact of pad conditioning on process performance
Type :
Conference paper
Publication Status :
published
Access :
restrictedAccess
Abstract
This study presents an effort to couple a wafer removal rate profile model based on the locally relevant Preston equation to the change in pad thickness profile which reflects to post polish profile of the wafers after Chemical Mechanical Planarization. The result is a dynamic predictor of how the wafer removal rate profile shifts as the pad ages. These predictions can be used to fine tune the conditioner operating characteristics without having to carry out high cost and time consuming experiments. The accuracy of the predictions is demonstrated by individual confirmation experiments in addition to the evaluation of the defectivity performance with the varied pad conditioning profiles.
Source :
Materials Research Society Symposium Proceedings
Date :
2012
Volume :
1428
Publisher :
Cambridge University Press
URI
http://hdl.handle.net/10679/4244http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=8652345&fileId=S1946427412013590
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