Browsing by Author "Kıncal, S."
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A modeling study on the layout impact of with-in-die thickness range for STI CMP
Kıncal, S.; Başım, Gül Bahar (ECS, 2013)Chemical Mechanical Planarization process has a proven track record as an effective method for planarizing the wafer surface at multiple points of the semiconductor manufacturing flow. One of the most challenging aspects ...
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